0102030405
Copper Silicide (Cu5Si) Powder CAS 12159-07-8
Properties
- Chemical Formula: Cu₅SiComposition: Si:8.12%, Cu:91.88%Molecular Weight: ~345.84 g/molDensity: ~7.8–8.2 g/cm³ (estimated)Crystal Structure: Cubic (expected, similar to Cu-Si phases)Melting Point: ~800–850°C (varies with microstructure)Electrical Conductivity: ~85% IACS (International Annealed Copper Standard)
Products Usage
1. Electronics: Ohmic contacts, interconnects, and diffusion barriers in high-frequency circuits and power devices.
2. Conductive Coatings: Anti-corrosion coatings for marine equipment and chemical processing hardware.
3. Thermal Management: Heat sinks and thermal interface materials for high-power electronics.
4. Industrial Alloys: Additive in copper-based alloys for enhanced wear resistance.
5. Additive Manufacturing: Feedstock for 3D-printed conductive components.
Packing:
Our normal packaging is 25kgs/Drum
The packaging can be customized. the shipping term can be by sea, by air, and sample or small quantity can be shipped by DHL, FEDEX, EMS and TNT.
Remark: Chemical composition and size can be optimized by the customers' requirements

Conditions for safe storage, including any incompatibilities
Separated from ammonia, strong hydrogen peroxide solutions and strong acids.
Safety Protection
Precautions for safe handling
Handling in a well ventilated place. Wear suitable protective clothing. Avoid contact with skin and eyes. Avoid formation of dust and aerosols. Use non-sparking tools. Prevent fire caused by electrostatic discharge steam.



