0102030405
TaN Tantalum Nitride Powder CAS 12033-62-4
Properties
- Chemical Formula: TaNComposition: N:7.18%, Ta:92.82%Molecular Weight: 194.95 g/molDensity: 13.4–14.6 g/cm³Crystal Structure: Hexagonal (ε-phase, space group P6₃/mmc)Melting Point: ~3090°C (decomposes)Vickers Hardness: 18–22 GPaElectrical Resistivity: 200–300 μΩ·cmPurity: 99.5% (standard), 99.95% (semiconductor grade)
Products Usage
1. Semiconductor Industry:
Diffusion barrier layer in Cu interconnects (45nm–5nm nodes)
Gate electrode material in advanced CMOS devices
2. Cutting Tools: Coating for carbide inserts (TiAlN/TaN multilayers)
3. Precision Electronics: Thin-film resistors (50–1000 Ω/sq, ±1% tolerance)
4. Medical Implants: Corrosion-resistant coating for surgical tools
5. Space Technology: Thermal protection for re-entry vehicles
Packing:
Our normal packaging is 25kgs/Drum
The packaging can be customized. the shipping term can be by sea, by air, and sample or small quantity can be shipped by DHL, FEDEX, EMS and TNT.
Remark: Chemical composition and size can be optimized by the customers' requirements

Conditions for safe storage, including any incompatibilities
Separated from ammonia, strong hydrogen peroxide solutions and strong acids.
Safety Protection
Precautions for safe handling
Handling in a well ventilated place. Wear suitable protective clothing. Avoid contact with skin and eyes. Avoid formation of dust and aerosols. Use non-sparking tools. Prevent fire caused by electrostatic discharge steam.



